At Calmeasures, we understand the critical role lead frames play in ensuring reliable connections between semiconductor chips and printed circuit boards (PCBs). These thin metal strips, commonly made from copper or copper alloys like CA194, or Fe-Ni alloys such as Kovar, are essential for facilitating communication between integrated circuits and other PCB components.

Lead frames are typically plated with materials like silver, gold, gold-silver alloys, palladium, and nickel to provide corrosion resistance and ensure solderability. These plated layers are essential in maintaining long-term performance, especially as the frames undergo stamping or etching into precise patterns before being bonded to semiconductor chips. Once bonded, the assembly is encapsulated and ready to be soldered onto a PCB.

Calmeasures offers a range of high-precision standards for measuring the various plated layers applied to lead frames. Our solutions ensure that your coatings meet the stringent requirements needed for durability and optimal performance. Explore our complete list of standards for lead frame applications under the Coating Thickness XRF Standards in the Products tab, and see how Calmeasures can help elevate the quality of your lead frame production.