Calmeasures offers precision solutions for the semiconductor industry, covering both front-end and back-end production processes. From thin film metallizations on silicon wafers to intricate nano-circuit lines, we provide the standards you need to ensure flawless performance at every stage.

In semiconductor manufacturing, thin metal layers are meticulously deposited on silicon wafers, which are later etched into nano-scale interconnects for integrated circuits. These metallized wafers, diced into chips, power the world’s most advanced technologies. Additionally, metallizations such as bonding pads and bumps play crucial roles in the final assembly and packaging phases.

Our standards are designed to provide accurate, reliable measurements for the coatings applied in semiconductor processes, helping you meet the most stringent industry specifications. Explore our full range of semiconductor-specific standards under the Coating Thickness XRF Standards in the Products tab, and discover how Calmeasures can elevate the precision and quality of your semiconductor production.